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Power Management Switch IC Series for PCs and Digital Consumer Product
1ch Small Current Output Power Management Switch ICs
BD2202G, BD2206G
No.09029EAT07
Description The High-side switch for memory card slot is an IC High-side switch with a function of over-current protection used in the power supply line of a memory card slot. In the switch part an N channel MOSFET low ON resistance has been 1 circuit integrated. The switch goes OFF when the over-current condition lasts longer than the over-current shutdown time. The OFF switch is set on latch off mode.The operating voltage range is 2.7V to 3.6V and the current limit value is set on 400mA, 1A. Moreover, a soft start function, an under voltage lockout function and an over temperature protection function are integrated. Feature 1) 2) 3) 4) 5) 6) 7) 8) 9)
Single low on-resistance (Typ. = 150m) Nch MOS FET Continuous load current 0.2A(BD2202G) / 0.5A(BD2206G) Control input logic: Active-High Soft start function Over current protection circuit Over temperature protection circuit Under voltage lockout Power supply voltage range 2.7V3.6V Operating temperature range -2585
Applications Memory card slots of STB, Digital still camera, Cell Phones, Notebook PC. Line up Parameter Continuous load current (A) Short circuit current limit (A) Logic Control input Absolute Maximum Ratings Parameter Supply voltage En voltage OUT voltage Storage temperature Power dissipation
*1 * *
BD2202G 0.2 0.4 High
BD2206G 0.5 1.0 High
Symbol VIN VEN VOUT TSTG PD
Limits -0.3 to 6.0 -0.3 to 6.0 -0.3 to VIN + 0.3 -55 to 150 675*1
Unit V V V C mW
Mounted on 70mm * 70mm * 1.6mm grass-epoxy PCB. Derating : 5.4mW/ for operating above Ta=25 Does not do radiation resistance design. There is no operation guarantee.
Operating conditions BD2202G Parameter Operating voltage range Operating temperature range Operating load current BD2206G Parameter Operating voltage range Operating temperature range Operating load current
Symbol VIN TOPR ILO
Limits 2.7 to 3.6 -25 to 85 0 to 200
Unit V C mA
Symbol VIN TOPR ILO
Limits 2.7 to 3.6 -25 to 85 0 to 500
Unit V C mA
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1/12
2009.05 - Rev.A
BD2202G,BD2206G
Electrical characteristics BD2202G (Unless otherwise specified, VIN = 3.3V, Ta = 25C) DC characteristics Limits Parameter Symbol Min. Typ. Max. Operating current IDD 70 90 Standby current ISTB 0.01 1 2.0 EN input voltage VEN 0.8 EN input current IEN -1.0 0.01 1.0 ON resistance RON 150 200 Short-circuit output current ISC 200 600 Output leak current ILEAK 0.01 10 VTUVH 2.1 2.3 2.5 UVLO threshold VTUVL 2.0 2.2 2.4 AC characteristics Parameter Output rise time Output turn on time Output fall time Output turn off time Over current shutdown time 1 Over current shutdown time 2 Symbol TON1 TON2 TOFF1 TOFF2 TBLANK1 TBLANK2 Min. 0.25 0.4 50 50 5 3 Limits Typ. 1.2 2 100 100 10 Max. 6 10 200 200 15 15 Unit ms ms s s ms ms
Technical Note
Unit A A V V A m mA A V V
Condition VEN = 3.3V, VOUT = OPEN VEN = 0V, OUT = OPEN High level input Low level input VEN = 0V or VEN = 3.3V IOUT = 50mA VOUT = 0V VEN = 0V, VOUT = 0V VIN increasing VIN decreasing
Condition ROUT=500, COUT=0.1F ROUT=500, COUT=0.1F ROUT=500, COUT=0.1F ROUT=500, COUT=0.1F At continuous over current At discontinuous over current
BD2206G (Unless otherwise specified, VIN = 3.3V, Ta = 25C) DC characteristics Limits Parameter Symbol Min. Typ. Max. Operating current IDD 70 90 Standby current ISTB 0.01 1 2.0 EN input voltage VEN 0.8 EN input current IEN -1.0 0.01 1.0 ON resistance RON 150 200 Short-circuit output current ISC 750 1350 Output leak current ILEAK 0.01 10 VTUVH 2.1 2.3 2.5 UVLO threshold VTUVL 2.0 2.2 2.4 AC characteristics Parameter Output rise time Output turn on time Output fall time Output turn off time Over current shutdown time 1 Over current shutdown time 2 Symbol TON1 TON2 TOFF1 TOFF2 TBLANK1 TBLANK2 Min. 0.25 0.4 50 50 5 3 Limits Typ. 1.2 2 100 100 10 Max. 6 10 200 200 15 15
Unit A A V V A m mA A V V
Condition VEN = 3.3V, VOUT = OPEN VEN = 0V, OUT = OPEN High level input Low level input VEN = 0V or VEN = 3.3V IOUT = 50mA VOUT = 0V VEN = 0V, VOUT = 0V VIN increasing VIN decreasing
Unit ms ms s s ms ms
Condition ROUT=500, COUT=0.1F ROUT=500, COUT=0.1F ROUT=500, COUT=0.1F ROUT=500, COUT=0.1F At continuous over current At discontinuous over current
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2/12
2009.05 - Rev.A
BD2202G,BD2206G
Measurement circuits VIN GND EN NC OUT
Technical Note
VIN GND EN
OUT
NC
Operating current
EN input voltage, Output rise / fall time
VIN GND EN
OUT
VIN GND
OUT
NC
EN
NC
ON resistance
Over current protection characteristics Fig.1 Measurement circuits
Timing diagrams
VEN
50%
50%
Over current detection
TON2
TOFF2
VOUT
90% VOUT 10% TON1
90%
IOUT
10% TOFF1
TBLANK
Fig.2 Switch Turn on / off time
Fig.3 Over current limits characteristics
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3/12
2009.05 - Rev.A
BD2202G,BD2206G
Reference data
90 80 OPERATING CURRENT : IDD [A] 70 60 50 40 30 20 10 0 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] 4
90
Technical Note
1.0 VIN=3.3V OPERATING CURRENT : ISTB[uA] 0.8 0.6 0.4 0.2 0.0
-50 0 50 100
Ta=25C
OPERATING CURRENT : IDD [A]
Ta=25C
80 70 60 50 40 30 20 10 0
2
AMBIENT TEMPERATURE : Ta [C]
2.5 3 3.5 SUPPLY VOLTAGE : VIN [V]
4
Fig.4 Operating current EN Enable
Fig.5 Operating current EN Enable
Fig.6 Operating current EN Disable
1.0
2.0 VIN=3.3V Ta=25C ENABLE INPUT VOLTAGE : VEN, V/EN[V] 0 1.5 Low to High
2.0 ENABLE INPUT VOLTAGE : VEN, V/EN[V]
VIN=3.3 V Low to High
OPERATING CURRENT : ISTB[uA]
0.8 0.6 0.4 0.2 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta []
1.5
High to Low
1.0
High to Low
1.0
0.5
0.5
0.0 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN[V] 4
0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[]
Fig.7 Operating current EN Disable
250 Ta=25C 200
ON RESISTANCE : RON[m]
ON RESISTANCE : RON[m]
Fig.8 EN input voltage
Fig.9 EN input voltage
250 200 150 100 50 0 2 2.5 3 3.5 SUPPLY VOLTAGE : VDD[V] 4 -50 0 50 100 AMBIENT TEMPERATURE : Ta []
SHORT CIRCUIT CURRENT : ISC[A]
0.6 VIN=3.3V Ta=25C 0.5
150 100 50 0
0.4
0.3
0.2 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN[V] 4
Fig.10 ON resistance
Fig.11 ON resistance
Fig.12 Short circuit output current (BD2202G)
0.6
SHORT CIRCUIT CURRENT : ISC[A] SHORT CIRCUIT CURRENT : ISC[A]
1.35 VIN=3.3V Ta=25C 1.25 1.15 1.05 0.95 0.85 0.75 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN[V] 4
SHORT CIRCUIT CURRENT : ISC[A]
1.35
VIN=3.3V
1.25 1.15 1.05 0.95 0.85 0.75 -50 0 50 100 AMBIENT TEMPERATURE : Ta[]
0.5
0.4
0.3
0.2 -50 0 50 100 AMBIENT TEMPERATURE : Ta[]
Fig.13 Short circuit output current (BD2202G)
Fig.14 Short circuit output current (BD2206G)
Fig.15 Short circuit output current (BD2206G)
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4/12
2009.05 - Rev.A
BD2202G,BD2206G
Technical Note
OVER CURRENT SHUTDOWN TIME : TBLANK1[ms]
14 13 12 11 10 9 8 7 6 5 2
OVER CURRENT SHUTDOWN TIME : TBLANK1[ms]
15
Ta=25C
15 14 13 12
VIN=3.3V
2500
Ta=25C
2000 RISE TIME : TON1 [us]
11 10 9 8 7 6 5 -50 0 50 SUPPLY VOLTAGE : Ta[] 100
1500 1000
500
0 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN[V] 4
2.5 3 3.5 SUPPLY VOLTAGE : VIN[V]
4
Fig.16 Over current shutdown time
Fig.17 Over current shutdown time
Fig.18 Output rise time
2500
VIN=3.3V
2500
2500
Ta=25C
2000 TURN ON TIME : TON2 [us]
VIN=3.3V
2000 RISE TIME : TON1 [us]
2000 TURN ON TIME : TON2 [ms]
1500 1000
1500
1500 1000
1000
500
500
500
0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[]
0 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN[V] 4
0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[]
Fig.19 Output rise time
Fig.20 Output turn on time
Fig.21 Output turn on time
200
Ta=25C
200
VIN=3.3V
200
Ta=25C
TURN OFF TIME : TOFF2[us]
FALL TIME : TOFF1 [us]
FALL TIME : TOFF1[us]
150
150
150
100
100
100
50 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN[V] 4
50 -50 0 50 100 AMBIENT TEMPERATURE : Ta[]
50 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN[V] 4
Fig.22 Output fall time
Fig.23 Output fall time
Fig.24 Output turn off time
200
VIN=3.3V
2.5 2.4 UVLO HYSTERESIS VOLTAGE : VHYS[V] 0 50 100
0.20 0.16 0.12 0.08 0.04 0.00 -50 0 50 100 AMBIENT TEMPERATURE : Ta[]
TURN OFF TIME : TOFF2 [us]
TURN OFF TIME : TOFF2[us]
150
2.3 2.2 2.1 2 -50
VUVLOH
100
VUVLOL
50 -50 0 50 100 AMBIENT TEMPERATURE : Ta[]
AMBIENT TEMPERATURE : Ta[]
Fig.25 Output turn off time
Fig.26 UVLO threshold voltage
Fig.27 UVLO hysteresis voltage
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5/12
2009.05 - Rev.A
BD2202G,BD2206G
Waveform data
Technical Note
IOUT (0.1A/div.) VOUT (1/div.) VOUT (1/div.) VOUT (1V/div.) VIN=3.3V RL=500 CL=0.1 VIN=3.3V CIN=10uF CL=0.1uF
V/EN (1/div.) TIME (0.5div.)
VIN=3.3V RL=500 CL=0.1uF
V/EN (1/div.) TIME (0.5div.)
VEN (1V/div.) TIME (2ms/div.)
Fig.28 Output turn on response
Fig.29 Output turn off response
Fig.30 Current limit response Enable into short circuit (BD2202G)
IOUT (0.2A/div.) VIN=3.3V CIN=10uF CL=0.1uF
IOUT (0.2A/div.)
IOUT (0.2A/div.)
VOUT (1V/div.)
VEN (1V/div.) TIME (2ms/div.)
VOUT (1V/div.)
VIN=3.3V CIN=10uF CL=0.1uF
VOUT (1V/div.)
VIN=3.3V CIN=10uF CL=0.1uF
TIME (2ms/div.)
TIME (2ms/div.)
Fig.31 Current limit response Enable into short circuit (BD2206G)
Fig.32 Current limit response Output shorted to GND (BD2202G)
Fig.33 Current limit response Output shorted to GND (BD2206G)
VIN (1V/div.)
IOUT (0.1A/div.)
IOUT (0.2A/div.) VOUT (1V/div.) VIN=3.3V CIN=10uF CL=0.1uF VIN=3.3V CIN=10uF CL=0.1uF
VOUT (1V/div.)
VOUT (1V/div.)
IOUT (10mA/div.)
RL=500 CL=0.1uF
TIME (5ms/div.)
TIME (5ms/div.)
TIME (5ms/div.)
Fig.34 Current limit response Ramped load (1A/10ms) (BD2202G)
Fig.35 Current limit response Ramped load (1A/10ms) (BD2206G)
Fig.36 UVLO VIN rising
VIN (1V/div.)
VOUT (1V/div.)
IOUT (10mA/div.)
RL=500 CL=0.1uF
TIME (500ms/div.)
Fig.37 UVLO VIN falling
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6/12
2009.05 - Rev.A
BD2202G,BD2206G
Block diagram
VIN Current limit GND Charge pump VOUT UVLO Control logic
Technical Note
VIN GND EN
OUT
NC
EN
Thermal shutdown
Fig.38 Block diagram
Fig.39 Pin configuration
Pin description Pin Number Pin Name
I/O I
Pin function Power supply input terminal. Input terminal to the power switch and power supply input terminal of the internal circuit. Ground. Power Switch enable input. Active-High Switch on input. A logic high turns the switch on. No connection. Not internally connected.
1
VIN
2
GND
I
3
EN
I
4
N.C
-
5
VOUT
O
Power switch output
I/O circuit
Pin Name
Pin Number
Equivalent circuits
EN
3
VOUT
5
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7/12
2009.05 - Rev.A
BD2202G,BD2206G
Technical Note
Operation description BD2202G and BD2206G are high side switch IC with over-current protection function. The operating voltage range is from 2.7V to 3.6V and the current limit value is set on 400mA, 1A. When an over-current condition lasts longer than an over-current shutdown time, the switch turns OFF. The OFF switch is set on latch mode. The switch set on latch mode returns (to normal) by toggling EN pin from High to Low to High.
1.Switch On/Off control VIN and VOUT pins are connected to each switch MOSFET drain and source. Moreover, VIN pin is also used as a power supply input for the internal control circuit. When the switch is turned on from EN control input, VIN and VOUT is connected by a 150m switch. In normal condition, the switch shows bidirectional. Therefore, when the voltage of VOUT is higher than VIN the current flows from VOUT to VIN. In the switch MOSFET, there is a parasitic diode (body diode) between drain and source. So, even when the switch is off, when voltage of VOUT is higher than VIN, the current flows through the body diode from VOUT to VIN. 2. Over current detection (OCD) The over current detection circuit limits current when current flowing in switch MOSFET exceeds the current limit threshold. There are three types of response against over current. The over current detection circuit is in operation when the power switch is ON (when EN signal is active). 2-1 When the switch is turned on while the output is in short-circuit status When the switch is turned on while the output is in short-circuit status, the switch become current limit mode soon. 2-2 When the output short-circuits while the switch is on When the output short-circuits or heavy load is connected while the switch is on, very large current flows until the over current limit circuit responds. When the current detection, limit circuit works, current limitation is carried out. 2-3 When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 3.Over current shutdown When the over-current detection circuit detects an over-current, TBLANK timer starts working. When the over-current condition disappears before TBLANK2 stage, TBLANK timer is reset. When the over-current condition progresses to more than TBLANK1, the switch is shut off. The OFF switch is set on latch off mode. The latch is reset when EN terminal is toggled or when UVLO is detected. 4.Under voltage lockout (UVLO) UVLO keeps the power switch off until VIN voltage exceeds 2.3V (Typ.). Moreover, from a power switch ON situation, if VIN voltage drops to 2.2V (Typ.), the power switch is set on OFF. UVLO has a 100mV hysteresis. The under voltage lock out circuit is in operation when power switch is ON (when EN signal is active). 5.Thermal shutdown When the chip temperature increases to 160C (Typ.), the thermal shut down circuit works and the power switch is turned OFF. When the chip temperature falls to 140C (Typ.), the power switch output returns (to normal). This operation will repeat itself until the causes of the chip temperature rise are removed or until the power switch output is turned off. The thermal shutdown circuit is in operation when the power switch is ON (when EN signal is active).
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8/12
2009.05 - Rev.A
BD2202G,BD2206G
Technical Note
TBLANK2
TBLANK1
Output current ON Switch status OFF ON
EN voltage
Fig.40 Over-current detection, shutdown operation (return with EN input)
TBLANK2
TBLANK1
Output current ON Switch status OFF ON
VIN voltage
VTUVL
VTUVH
Fig.41 Over-current detection, shutdown operation (return with UVLO operation)
Typical application circuit
VIN VIN Cin Current limit Charge pump VOUT UVLO Control logic Cout Rout
EN OFF ON
Thermal shutdown GND
Fig.42 Typical application circuit
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9/12
2009.05 - Rev.A
BD2202G,BD2206G
Technical Note
Application information When an excessive current flows because of an output short circuit, a noise caused by the inductance of power supply to the IC breaks out and it is possible that it influences negatively the IC operation. In order to avoid this problem, please connect CIN bypass capacitor close to the IC VIN and GND pins of the IC. More than 1F is recommended.
Due to the internal body diode in the switch, a CIN greater than COUT is highly recommended. This system connection diagram does not guarantee operation as an application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics.
Power dissipation characteristics (SSOP5)
800 700 POWER DISSIPATION : Pd [mW] 600 500 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE : Ta []
Fig.43 Power dissipation curve (Pd-Ta Curve)
Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc.
(2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC's power supply terminal.
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10/12
2009.05 - Rev.A
BD2202G,BD2206G
Technical Note
(4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use.
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11/12
2009.05 - Rev.A
BD2202G,BD2206G
Ordering part number
Technical Note
B
D
2
Part No. 2202 2206
2
0
2
G
-
T
R
Part No. model
Package G: SSOP5
Packaging and forming specification TR: Embossed tape and reel (SSOP5)
SSOP5
2.90.2
5 4
+6 4 -4

Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR
The direction is the 1pin of product is at the upper right when you hold
+0.2 1.6 -0.1
2.80.2
1
2
3
0.2Min.
( reel on the left hand and you pull out the tape on the right hand
1pin
)
+0.05 0.13 -0.03
1.25Max.
1.10.05
0.050.05
+0.05 0.42 -0.04 0.95 0.1
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
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12/12
2009.05 - Rev.A
Notice
Notes
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